Title:
電子部品の製造方法及び電子部品
Document Type and Number:
Japanese Patent JP7233837
Kind Code:
B2
Abstract:
A method of manufacturing an electronic component includes: preparing an element body configured to have a rectangular parallelepiped shape and include a first surface serving as a mounting surface, a second surface opposing the first surface, and a third surface extending in such a way as to connect the first surface and the second surface; forming a chamfered portion chamfered between the first surface and the third surface; forming a terminal electrode on the first surface; covering the chamfered portion and the first surface with a covering member; forming a metal shield film on a part of the element body, the part including at least the second surface and the third surface and exposed from the covering member; and removing the covering member.
Inventors:
Yoshinori Sato
Shigeyuki Doi
Takeo Ogimoto
Shigeyuki Doi
Takeo Ogimoto
Application Number:
JP2017247338A
Publication Date:
March 07, 2023
Filing Date:
December 25, 2017
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01G2/22; H01F41/04
Domestic Patent References:
| JP2017054891A | ||||
| JP2017076796A | ||||
| JP2009290677A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Mikami Takashi
Yoshiki Kuroki
Mikami Takashi