Title:
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2004186307
Kind Code:
A
Abstract:
To provide a manufacturing method of an electronic component which controls the thickness of a layer in the electronic component surely, and the electronic component manufactured by employing the manufacturing method.
A conductor unit 14 is formed on the surface 12 of a supporting member 10. After forming the conductor unit 14, a copper foil 18 with a resin 16 is lowered from the upper part of the conductor unit 14 to pressurize the copper foil 18 under the state of covering the conductor unit 14. An insulating layer 24 can be made to copy the height of the conductor unit 14 by pressurizing the copper foil 18 with the resin 16 up to the height of the conductor unit 14 employing the conductor unit 14 as a stopper.
Inventors:
GOTO MASASHI
KAWASAKI KAORU
YAMAMOTO HIROSHI
NAKANO MUTSUKO
KAWASAKI KAORU
YAMAMOTO HIROSHI
NAKANO MUTSUKO
Application Number:
JP2002349838A
Publication Date:
July 02, 2004
Filing Date:
December 02, 2002
Export Citation:
Assignee:
TDK CORP
International Classes:
H05K3/40; H05K1/11; H05K3/46; H05K3/20; (IPC1-7): H05K3/40; H05K1/11
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa