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Patent Searching and Data


Title:
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2006041017
Kind Code:
A
Abstract:

To provide an electronic component assuring low resistance, heavier current and less variations in characteristics.

A first groove 52 is formed to a first green sheet 42 by irradiating the upper surface 42a of the first green sheet 42 with the laser beam. A second groove 54 is formed to a second green sheet 46 by irradiating an upper surface 46a of the second green sheet 46 with the laser beam. A first electrode 24 is formed by filling the first groove 52 of the first green sheet 42 with a conductive paste, and a second electrode 26 is formed by filling the second groove 54 of the second green sheet 46 with the conductive paste. A laminate 62 is manufactured by providing in opposition the upper surface 42a of the first green sheet 42 and the upper surface 46a of the second green sheet 46, and then providing the third green sheet 50 between the first and second green sheets 42, 46. The laminate 62 is baked to manufacture an electronic component.


Inventors:
NAKAJO SUSUMU
TAKAHASHI HIROMITSU
MACHIDA KANJI
Application Number:
JP2004215632A
Publication Date:
February 09, 2006
Filing Date:
July 23, 2004
Export Citation:
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Assignee:
SOSHIN ELECTRIC
International Classes:
H01F38/14; H01F17/00; H01F19/06; H05K1/02; H05K3/00; H05K3/10; H05K3/46
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera