Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP7171059
Kind Code:
B2
Abstract:
Provided are an electronic component manufacturing method by which even a platable layer made of a difficult-to-plate material can be easily plated with good adhesion without using a special chemical solution or a photolithography technique, and an electronic component which has a peel strength of 0.1 N/mm or greater as measured by a copper foil peel test. A picosecond laser beam having a pulse duration on the order of a picosecond or a femtosecond laser beam having a pulse duration on the order of a femtosecond is emitted at a surface of a platable layer (2) in order to roughen the surface, a wiring pattern is formed using a mask (13), and a plated part (12) is formed on the surface of the wiring pattern.
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Inventors:
Reiji Oya
Seiichi Kaihara
Shinko Hiroshi
Hirokazu Shikata
Seiichi Kaihara
Shinko Hiroshi
Hirokazu Shikata
Application Number:
JP2019556114A
Publication Date:
November 15, 2022
Filing Date:
September 19, 2018
Export Citation:
Assignee:
Quortec Co., Ltd.
International Classes:
C25D5/56; C23C18/22; C25D5/02; C25D5/54; H05K3/06; H05K3/18; H05K3/38
Domestic Patent References:
| JP2017166003A | ||||
| JP2015010268A |
Foreign References:
| WO2016152938A1 |
Other References:
株式会社クオルテック,フェムト秒レーザを用いた微細加工技術,2012年,全文,http://www.qualtec.co.jp/seminar/pdf/electrotest_2010_3.pdf
上山宏治,プリント配線板の製造法,表面技術,日本,1993年,Vol.44、No.7,p.566-572
上山宏治,プリント配線板の製造法,表面技術,日本,1993年,Vol.44、No.7,p.566-572
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