To provide an electronic component measuring jig which is easy to manufacture and hard to break.

An electronic component measuring jig 100 according to the present invention comprises an insulating substrate 1, metal foil 2, a solder resist film 3 and a plurality of metal terminals 7. The solder resist film 3 includes solder resist film non-formation parts 4a. The metal terminals 7 formed of a single plate are soldered to the solder resist film non-formation parts 4a of the metal foil 2, with contact parts 7a with which terminal electrodes of the electronic component to be measured come into contact extended on the insulating substrate 1 on which the metal foil 2 is not formed. A thickness X of the metal foil 2 has a relation of X≥0.5Y with respect to a thickness Y of the metal terminals 7.