To provide an electronic component metal material having low whiskering, low adhesive wear and high durability, to provide a connector terminal using the electronic component metal material, and an electronic component.
This electronic component metal material is provided with: a substrate; a lower layer formed on the substrate and configured from one or more elements selected from constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu; a middle layer formed on the lower layer and configured from one or more elements selected from constituent element group B consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; an upper layer formed on the middle layer and configured from an alloy of one or more elements selected from constituent element group B consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and one or two elements selected from constituent element group C consisting of Sn and In; and a topmost layer formed on the upper layer and configured from one or two elements selected from constituent element group C consisting of Sn and In. The thickness of the lower layer is greater than or equal to 0.05 μm and less than 5.00 μm, the thickness of the middle layer is greater than or equal to 0.01 μm and less than 0.50 μm, and the thickness of the upper layer is greater than or equal to 0.02 μm and less than 0.80 μm.
FUKAMACHI KAZUHIKO
KODAMA ATSUSHI
| JP2010037629A | 2010-02-18 | |||
| JP2011122234A | 2011-06-23 | |||
| JP2005126763A | 2005-05-19 | |||
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| JP2010262861A | 2010-11-18 | |||
| JP2010037629A | 2010-02-18 | |||
| JP2011122234A | 2011-06-23 | |||
| JP2005126763A | 2005-05-19 |