To provide electronic component metal material having low whiskering, low adhesive wear and high durability, and to provided a connector terminal using the electronic component metal material, and a connector terminal and an electronic component.
This electronic component metal material includes: a substrate; a lower layer formed on the substrate and configured from one or more elements selected from constituent element group A consisting of Ni, Cr, Mn, Fe, Co and Cu; a middle layer formed on the lower layer and configured from an alloy of one or more elements selected from constituent element group B consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir, and one or two elements selected from constituent element group C consisting of Sn and In; and an upper layer formed on the middle layer and configured from one or two elements selected from constituent element group C consisting of Sn and In, and a thickness of the lower layer is 0.05 μm or more to less than 5.00 μm, the thickness of the middle layer is 0.02 μm or more to less than 0.80 μm and the thickness of he upper layer is 0.005 μm or more to less than 0.30 μm.
FUKAMACHI KAZUHIKO
KODAMA ATSUSHI
| JP2011122234A | 2011-06-23 | |||
| JPH11350189A | 1999-12-21 | |||
| JPH05311495A | 1993-11-22 | |||
| JP2010262861A | 2010-11-18 | |||
| JP2011122234A | 2011-06-23 | |||
| JPH11350189A | 1999-12-21 | |||
| JPH05311495A | 1993-11-22 | |||
| JP2010262861A | 2010-11-18 |