Title:
ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC COMPONENT MODULE
Document Type and Number:
Japanese Patent JP3875240
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component which can accurately ensure an operating space for an electronic machine element having an operating part and can maintain a mechanical strength of a substrate, a lamination module using the electronic component at a low cost, and to provide its manufacturing method.
SOLUTION: The electronic component has a semiconductor substrate, a cavity penetrating from the front face of the semiconductor substrate to a rear face thereof, the electronic machine element having the operating part formed on the semiconductor substrate so as to dispose the operating part on the cavity, and a conductive plug penetrating from the front face of the semiconductor substrate to the rear face thereof to be electrically connected to the electronic machine element. The module has the electronic component and a circuit chip stacked on the electronic part via a spacer. In the method for manufacturing the electronic part, a trench is formed from the front side of the semiconductor substrate, and a sacrificial film is buried in the trench. The electronic machine element having the operating part is formed on the semiconductor substrate so that the operating part is located on the trench, to be ground until the sacrificial film is exposed from the rear side of the semiconductor substrate, and the sacrificial film is removed from the rear side of the semiconductor substrate to form the cavity in the trench.
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Inventors:
Mie Matsuo
Application Number:
JP2004106204A
Publication Date:
January 31, 2007
Filing Date:
March 31, 2004
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L41/09; B81B3/00; B81B7/00; G01L9/00; G01P15/08; G01P15/09; H01L21/00; H01L37/02; H01L41/08; H01L41/113; H01L41/18; H01L41/187; H01L41/193; H01L41/22; H03H3/02; H03H9/10; H03H9/17; (IPC1-7): H01L41/09; H01L37/02; H01L41/18; H01L41/187; H01L41/193; H01L41/22
Domestic Patent References:
| JP7169661A | ||||
| JP10032454A | ||||
| JP11005305A | ||||
| JP2001066208A | ||||
| JP2001309491A | ||||
| JP2002234156A | ||||
| JP2003068779A | ||||
| JP2003291343A | ||||
| JP2004017171A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu