Title:
電子部品モジュールおよび電子部品素子
Document Type and Number:
Japanese Patent JP5370599
Kind Code:
B2
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Inventors:
Minami Akira
Application Number:
JP2012554816A
Publication Date:
December 18, 2013
Filing Date:
January 25, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L23/12; H01L21/60; H01L25/04; H01L25/18
Domestic Patent References:
| JP2006245289A | 2006-09-14 | |||
| JP2006344672A | 2006-12-21 |
Foreign References:
| WO2007080863A1 | 2007-07-19 |