Title:
ELECTRONIC COMPONENT MOUNTING APPARATUS AND GUIDE DISTANCE EXTENDING MEMBER
Document Type and Number:
Japanese Patent JP3969631
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus in which the base is commonable and the guide distance at the head section can be extended readily, and a guide distance extending member for use therein.
SOLUTION: The electronic component mounting apparatus 100 comprises a head section 3 having a suction nozzle 31 for suction holding an electronic component and mounting it at a predetermined position on an electronic circuit board by releasing suction, a beam 72 for reciprocally guiding the head section 3 in one direction, a Y-axis guide member 71 for reciprocally guiding the head section 3 in a direction orthogonal to the one direction as the beam 72 is reciprocally guided in the orthogonal direction. An L joint for extending the reciprocal guide distance of the suction nozzle 31 in the orthogonal direction can be fixed to the Y-axis end face of the Y-axis guide member 71.
Inventors:
Kazuhiro Matsutani
Application Number:
JP2001371404A
Publication Date:
September 05, 2007
Filing Date:
December 05, 2001
Export Citation:
Assignee:
JUKI Corporation
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Domestic Patent References:
| JP2001309634A | ||||
| JP8167568A |
Attorney, Agent or Firm:
Hiroshi Arafune