To provide an electronic component mounting apparatus capable of efficiently executing the maintenance work of a mounting head with excellent workability, and the mounting head for an electronic component.
In a buffer guide mechanism 40 which is mounted on the nozzle unit of the mounting head of the electronic component, and which vertically guides a nozzle holding part for freely detachably holding a suction nozzle and imparts downward energizing force by a compression spring member 42, a casing member 41 provided with a spring storage part 41a for storing the compression spring member 42 is provided with a support member 44 as a falling prevention part for preventing the compression spring member 42 from falling down from the spring storage part 41a. Thus, the falling of the compression spring member 42 during the maintenance work is prevented, and the maintenance work of the mounting head is efficiently executed with excellent workability.
KITAJIMA HIRONORI
| JP2008142880A | 2008-06-26 | |||
| JPS62107991A | 1987-05-19 | |||
| JPH10209690A | 1998-08-07 |
Hiroki Naito
Daisuke Nagano
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