Title:
ELECTRONIC COMPONENT MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JP3886192
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress relative movement of an electronic component and board and to improve a position accuracy by integrally associating a positioning unit of the board and a transfer head for placing the component with an operating unit having a moving means of the head, and supporting it to a supporting unit.
SOLUTION: A board 30, a positioning unit 29 for positioning it, a transfer head 26, and a nozzle 27 for sucking an electronic component 28 belong to an integral operating unit C, and hence the component 28 and the board 30 are vibrated in the same state. Accordingly, even if vibration is generated by moving the head 26, relative movement between the component 28 and the board 30 is not almost generated. Meanwhile, a supporting unit D has a base 20 and a coupling unit 21 stood upward on the base. The unit C is coupled to the unit D to be supported as the electronic component mounting apparatus. Accordingly, the unit 29 and the head 26 are constituted in the same unit so that the states of their vibrations substantially coincide.
Inventors:
Hiroyuki Sakaguchi
Application Number:
JP34298396A
Publication Date:
February 28, 2007
Filing Date:
December 24, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23P21/00; H05K13/04; (IPC1-7): H05K13/04; B23P21/00
Domestic Patent References:
| JP7157040A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano