Title:
電子部品実装装置および電子部品実装方法
Document Type and Number:
Japanese Patent JP4031625
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve product yield by preventing product defects from occurring due to a backup member. SOLUTION: An apparatus for mounting an electronic component mounts the electronic component on a substrate by using a pressurizing tool 6 in the state that the substrate is supported by the backup member 5. The apparatus is provided with a cleaning apparatus 7 for cleaning the backup surface 5a of the backup member 5.
Inventors:
Keigo Hirose
Application Number:
JP2001201514A
Publication Date:
January 09, 2008
Filing Date:
July 02, 2001
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H01L21/60; B08B1/00
Domestic Patent References:
| JP10064958A | ||||
| JP3044047A | ||||
| JP2001203240A | ||||
| JP7147300A | ||||
| JP6179022A |