Title:
電子部品実装装置および電子部品実装方法
Document Type and Number:
Japanese Patent JP5789681
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide an electronic component mounting device capable of performing mounting with mixed ranks. This electronic component mounting device (1) is provided with: an electronic component holding table (11) which holds a wafer sheet (200) on which multiple electronic components (100) of different ranks are arranged in a wafer shape; an electronic component information storage unit (41) which stores electronic component information comprising position information about the electronic components (100) on the wafer sheet (200) on the electronic component holding table (11) and rank information about said electronic components (100); a transfer head (30) which extracts one or more electronic components (100) from the wafer sheet (200) at a time and transfers and mounts the same on a mounting unit (300); an arrangement information storage unit (42) which stores arrangement information about the electronic components (100) on the mounting board (300); and a control unit which controls the transfer head (30) so as to mount the electronic components (100) at prescribed positions on the mounting board (300) on the basis of the electronic component information and arrangement information in a state in which the ranks are mixed.
Inventors:
Manabu Mochizuki
Yoshiaki Sakata
Toshiharu Shimizu
Hirokazu Hasegawa
Koji Watanabe
Makoto Sunaga
Shoichi
Hiroyuki Kosaka
Yoshiaki Sakata
Toshiharu Shimizu
Hirokazu Hasegawa
Koji Watanabe
Makoto Sunaga
Shoichi
Hiroyuki Kosaka
Application Number:
JP2013554119A
Publication Date:
October 07, 2015
Filing Date:
January 17, 2012
Export Citation:
Assignee:
Pioneer Corporation
Pioneer fa Co., Ltd.
Pioneer fa Co., Ltd.
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| JP1318297A | ||||
| JP2007065414A | ||||
| JP6045796A |
Attorney, Agent or Firm:
Ebisu International Patent Office