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Title:
ELECTRONIC-COMPONENT MOUNTING DEVICE, PROTECTION CIRCUIT MODULE FOR SECONDARY BATTERY AND BATTERY PACK USING THE SAME
Document Type and Number:
Japanese Patent JP2006186299
Kind Code:
A
Abstract:

To provide an electronic-component mounting device configured such that one or more electronic components are mounted on a wiring board with a mounting region of at least one electronic component covered with encapsulating resin, while preventing small voids from being incorporated into the encapsulating resin in the proximity to the electronic component.

The electronic-component mounting device has one or more electronic components 15 mounted on a wiring board 2 with a mounting region of at least one electronic component 15 covered with encapsulating resin 18, wherein a taper-formed structure 16 made of insulating resin is provided around the electronic component 15.


Inventors:
MORISHITA SEIICHI
Application Number:
JP2005121972A
Publication Date:
July 13, 2006
Filing Date:
April 20, 2005
Export Citation:
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Assignee:
RICOH KK
International Classes:
H01L21/56; H01M2/10; H01M2/34
Domestic Patent References:
JP2003298004A2003-10-17
JP2004111676A2004-04-08
JP2002231317A2002-08-16
JP2000307052A2000-11-02
JP2002314029A2002-10-25
JP2002216724A2002-08-02
Attorney, Agent or Firm:
Shigeo Noguchi