Title:
ELECTRONIC COMPONENT MOUNTING EQUIPMENT
Document Type and Number:
Japanese Patent JP3456081
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component mounting equipment wherein a transfer head vacuum-sucking an electronic component in the lower end portion of a nozzle and transferring and mounting the component on a board is installed, and a pad fixed on the lower end portion of the nozzle does not hinder a camera from observing an electronic component vacuum-sucked by other nozzle.
SOLUTION: A plurality of nozzles 3-8 are vertically movably installed on a rotary plate 2 fixed to the lower surface of a transfer head 1. A transparent pad 13 is fixed to the lower end portion of the nozzle 8. An electronic component 10 is vacuum-sucked by the pad 13. When the nozzle 7 adjacent to the pad 13 sucks an electronic component, and it is observed by a camera 11, the pad 13 does not hinder the observation of the electronic component, because the pad 13 is transparent and not discerned by the camera 11.
Inventors:
Satoshi Tanaka
Application Number:
JP1368496A
Publication Date:
October 14, 2003
Filing Date:
January 30, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23P21/00; B25J15/06; H05K13/04; H05K13/08; (IPC1-7): H05K13/04; H05K13/08
Domestic Patent References:
| JP516071U |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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