Title:
ELECTRONIC COMPONENT MOUNTING EQUIPMENT
Document Type and Number:
Japanese Patent JP3583319
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To facilitate excessive flux recovering work and maintenance work.
SOLUTION: In electronic component mounting equipment which mounts electronic components 15 on the electrode pad of a printed board by transferring flux to the solder bump of the parts 15, a flux transfer device 30 is constituted of a flux-storing section 3, a flux-supplying section 32 which supplies flux to the section 33, and a squeegee 46 which levels the flux supplied onto a rotary disk 40, constituting the flux storing section 33 so that the applied thickness of the flux reaches a prescribed value. The transfer device 30 is also constituted of a flux discharging section 34, which discharges excessive flux produced, when the flux is leveled from the central part of the rotary disk 40.
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Inventors:
Maruyama Shinichi
Application Number:
JP19472299A
Publication Date:
November 04, 2004
Filing Date:
July 08, 1999
Export Citation:
Assignee:
Hitachi High-Tech Instruments Co., Ltd.
International Classes:
H05K13/04; H05K3/34; (IPC1-7): H05K3/34
Domestic Patent References:
| JP6069285A | ||||
| JP58131741A | ||||
| JP62129180A | ||||
| JP11135572A | ||||
| JP10075044A |