Title:
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM
Document Type and Number:
Japanese Patent JP2015109398
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an electronic component mounting system capable of precisely mounting electronic components at high density.SOLUTION: The electronic component mounting system includes a screen printing unit and a solder application unit. The screen printing unit has a mask plate 22 which has a first part and a second part each having a thickness different from each other. The mask plate 22 is formed with pattern holes 22a, 22b corresponding lands 5A, 5Ba other than lands 5Bb in the plural lands 5 provided on the substrate 4, which are positioned in a step portion as the boundary between the first part and the second part and in an area of the substrate 4 overlapped with the vicinity thereof. The screen printing unit performs screen-printing with solder PA on the plural lands 5A, 5Ba using the mask plate 22. The solder application unit separately applies solder PB to the lands 5Bb using a dispenser 37. An electronic component mounting unit mounts electronic components 6 on the substrate 4 supplied with the solder.
Inventors:
NAKATSUJI HACHIRO
OKAMOTO KENJI
OKAMOTO KENJI
Application Number:
JP2013252647A
Publication Date:
June 11, 2015
Filing Date:
December 06, 2013
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05K3/34; B41F15/08; B41F15/12; B41F15/42; B41M1/12; H05K13/04
Domestic Patent References:
| JP2008027958A | 2008-02-07 | |||
| JPH02143860A | 1990-06-01 | |||
| JP2012201024A | 2012-10-22 | |||
| JPH07254778A | 1995-10-03 |
Attorney, Agent or Firm:
Kentaro Fujii
Kenji Kamada
Hiroo Maeda
Kenji Kamada
Hiroo Maeda
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