To provide an electronic component mounting system and an electronic component mounting method capable of mounting a shield component at a proper height dimension and with a sufficient bonding strength.
The electronic component mounting method includes: an inspection step for inspecting for any foreign matter in a region 23 where a wall of the mounted shield component 22 is positioned is set after mounting an electronic component 21 on a first soldering part S1 for bonding the electronic component and before mounting a shield component 22 on a second soldering part S2 for bonding the shield component; and a second electronic component mounting step in which the shield component 22 is mounted after mounting the shield component 22 on an additional soldering part SA formed by applying solder in the region 23 of a board 3 where is determined that no foreign matter is included in the inspection step. With this, the shield component 22 is prevented from being solder-bonded with a foreign matter included or with an insufficient amount of the solder. Thus, the shield component 22 can be mounted at a proper height dimension with a sufficient bonding strength.
OKAMOTO KENJI
ISHIMOTO KENICHIRO
OKAMURA HIROSHI
| JP2003078243A | 2003-03-14 | |||
| JP2008060249A | 2008-03-13 | |||
| JPH10335869A | 1998-12-18 |
Daisuke Nagano
Kentaro Fujii