Title:
電子部品包装体、電子部品連および電子部品連形成装置
Document Type and Number:
Japanese Patent JP7156236
Kind Code:
B2
Abstract:
An electronic component package includes a base tape having an elongated shape and including housing portions, each of which houses an electronic component, and a cover tape covering the base tape. The electronic component package includes first and second seal portions welded to sandwich the housing portions between the first and second seal portions and be parallel or substantially parallel to a longitudinal direction x of the electronic component package. A peeling strength of the first seal portion between the base tape and the cover tape is higher than a peeling strength of the second seal portion between the base tape and the cover tape.
Inventors:
Yasuhiro Shimizu
Application Number:
JP2019188101A
Publication Date:
October 19, 2022
Filing Date:
October 11, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B65D85/86; B65B15/04; B65D73/02
Domestic Patent References:
| JP2016034849A | ||||
| JP2007246113A | ||||
| JP2000344210A | ||||
| JP1103502U |
Foreign References:
| KR1020090027382A | ||||
| US20030019784 |
Attorney, Agent or Firm:
Okada
Hajime Ogiya
Hajime Ogiya