Title:
電子部品パッケージ
Document Type and Number:
Japanese Patent JP6648637
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component package having improved strength against external force.SOLUTION: An electronic component package 1 includes: a base material 10; an electronic component 20 provided on the base material 10; an outer shell 30 provided on the base material 10 as a package portion formed with an insulation material housing the electronic component 20 inside in a state where a hollow region R is formed between the outer shell and the electronic component 20; and a belt-like elastic line 40 provided on a surface of the package portion and its one end is fixed to the base material 10.SELECTED DRAWING: Figure 1
Inventors:
Kenichi Yoshida
Tatsuya Harada
Toru Inoue
Tatsuya Harada
Toru Inoue
Application Number:
JP2016103365A
Publication Date:
February 14, 2020
Filing Date:
May 24, 2016
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01L23/02; B81B7/02; H01L23/08
Domestic Patent References:
| JP10288625A | ||||
| JP2009537344A | ||||
| JP2007524514A | ||||
| JP8184608A | ||||
| JP2009196078A | ||||
| JP2008137139A |
Foreign References:
| US20090194309 | ||||
| US20040166603 | ||||
| KR1020090082148A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami
Yoshiki Kuroki
Takashi Mikami