Title:
ELECTRONIC COMPONENT PACKAGING BODY
Document Type and Number:
Japanese Patent JP2021195128
Kind Code:
A
Abstract:
To improve a supply amount of an electronic component.SOLUTION: An electronic component packaging body 10 includes: a carrier tape 20 having a plurality of storage recesses 211 and 212 aligned at intervals in a longitudinal direction X, and a plurality of feed holes 24 aligned at intervals in the longitudinal direction X at positions deviated from the plurality of storage recesses 211 and 212 in a width direction Y; a plurality of electronic components 50 stored in the plurality of storage recesses 211 and 212; a cover tape 30 covering the plurality of storage recesses 211 and 212; and a joint part 40 for joining the carrier tape 20 and the cover tape 30. The plurality of storage recesses 211 and 212 includes the plurality of first storage recesses 211 aligned in the longitudinal direction X, and the plurality of second storage recesses 212 which are provided in a space in the width direction Y between the plurality of first storage recesses 211 and the plurality of feed holes 24, and are aligned in the longitudinal direction X. The joint part 40 joins a first part 231, a second part 232 and a third part 233 of the carrier tape 20, and the cover tape 30.SELECTED DRAWING: Figure 1
Inventors:
OKAZAKI TADAHIRO
Application Number:
JP2020100135A
Publication Date:
December 27, 2021
Filing Date:
June 09, 2020
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
B65D85/86; B65D73/02
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
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