Title:
ELECTRONIC COMPONENT PACKAGING COVER TAPE
Document Type and Number:
Japanese Patent JP2017222387
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component packaging cover tape having an excellent balance between adhesiveness (tackiness) and transparency.SOLUTION: An electronic component packaging cover tape 10 is configured by stacking a substrate layer 1 and a sealant layer 2 provided to one surface side of the substrate layer 1 in a thickness direction. A plurality of projected parts 200 independent of one another are provided to the surface of the side of the electronic component packaging cover tape 10 where the sealant layer 2 is provided. The three-dimensional shapes of the plurality of projected parts 200 are roughly similar. The plurality of projected parts 200 are provided so as to be arranged in a lattice shape in the in-plane area of the surface of the side where the sealant layer 2 is provided.SELECTED DRAWING: Figure 2
Inventors:
HIRAMATSU MASAYUKI
YAMAGUCHI AKIRA
FURUKAWA TSUYOSHI
YAYAMA YOSHIHIRO
YAMAGUCHI AKIRA
FURUKAWA TSUYOSHI
YAYAMA YOSHIHIRO
Application Number:
JP2016118780A
Publication Date:
December 21, 2017
Filing Date:
June 15, 2016
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B65D85/86; B65D73/02
Domestic Patent References:
| JPH02108878U | 1990-08-29 | |||
| JP2013208817A | 2013-10-10 | |||
| JP2013208816A | 2013-10-10 | |||
| JP2013071779A | 2013-04-22 |
Foreign References:
| US20150108038A1 | 2015-04-23 |
Attorney, Agent or Firm:
Shinji Hayami