Title:
ELECTRONIC COMPONENT PACKAGING COVER TAPE AND ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
Japanese Patent JP2021138411
Kind Code:
A
Abstract:
To suppress breakage of a cover tape when peeling the cover tape from a carrier tape.SOLUTION: An electronic component packaging cover tape 1 comprises a base material layer 14, and a sealant layer 11 provided on one surface side thereof. The base material layer contains polyester, and has a thickness of 10 to 30 μm. When an average value of peel strength under [condition 1] is represented by FLow, and an average value of peel strength under [condition 2] is represented by FHigh, a value of FHigh/FLow is 1.0 to 2.0. [Condition 1] seal condition: a long object, which is formed in such a manner that the cover tape is slitted to a width of 5.3 mm, is brought into contact with a surface of a sheet for a carrier tape on a surface thereof on the sealant layer side, and is heat-sealed under the condition of 160°C, 4 kg/cm2, 0.1 second to obtain a complex. Peel condition: the composite is peeled under the condition of a peel rate of 300 mm/min, a peel angle of 180°. [Condition 2] this condition is same as the condition 1 except that a heat sealing temperature is set to 200°C.SELECTED DRAWING: Figure 1
Inventors:
YAKABE TORU
Application Number:
JP2020037899A
Publication Date:
September 16, 2021
Filing Date:
March 05, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B65D85/86; B65D65/40; B65D73/02
Domestic Patent References:
| JP2002002786A | 2002-01-09 | |||
| JP2010013135A | 2010-01-21 | |||
| JPH0752338A | 1995-02-28 | |||
| JP2017171393A | 2017-09-28 |
Foreign References:
| WO2015005330A1 | 2015-01-15 | |||
| WO2019087999A1 | 2019-05-09 | |||
| WO2016024529A1 | 2016-02-18 |
Attorney, Agent or Firm:
Shinji Hayami