To prevent crackings around a terminal electrode of an electronic component surface-packaged on a circuit board, and to prevent the breakage of the electronic component and degradation of electric characteristics, even if thermal history such as heating and cooling or an extraneous force is applied to the electronic component, while being used.

In a packaging structure, an electronic component 1 is constructed by packaging terminal electrodes 5 provided on the both ends of a ceramic sintered body 4 on a pair of wiring patterns 3 on an external circuit board 2, by using solders 6. If the line width of the wiring patterns 3 in a solder- packaging portion is Wh, the width of the ceramic sintered body 4 is Ws, the interval between the pair of wiring patterns 3 is Dh, and the interval between the terminal electrodes 5 is De, the relations 1.0≤Wh/Ws≤1.2 and 0.8≤Dh/De≤1.0 is satisfied.