Title:
ELECTRONIC COMPONENT PACKAGING SYSTEM AND ELECTRONIC COMPONENT PACKAGING METHOD
Document Type and Number:
Japanese Patent JP2015230960
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component packaging system capable of preventing a defective substrate from being generated.SOLUTION: The electronic component packaging system includes: a supply device capable of supplying an electronic component; a packaging device which includes a holding member for holding the electronic component in a removable manner and is capable of packaging the electronic component from the supply device onto the substrate while holding the electronic component by the holding member; an identification information acquisition section which acquires identification information indicating an identification of the electronic component of the supply device; a regular electronic component information acquisition section for acquiring regular electronic component information indicating an electronic component that should be packaged on the substrate; a component collation section which collates the identification information with the regular electronic component information to determine whether the electronic component of the supply device is an electronic component that should be packaged on the substrate; a control section for controlling the packaging device on the basis of a determination result of the component collation section; a manipulation device capable of generating a manipulation signal for converting a negative determination of the component collation section into a positive determination; a remaining count information acquisition section which acquires remaining count information indicating the number of remaining electronic components in the supply device; and an invalidation section for invalidating the manipulation device on the basis of the remaining count information.
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Inventors:
MIYAMOTO TETSURO
Application Number:
JP2014116296A
Publication Date:
December 21, 2015
Filing Date:
June 04, 2014
Export Citation:
Assignee:
JUKI KK
International Classes:
H05K13/04; H05K13/02; H05K13/08
Domestic Patent References:
| JP2014041895A | 2014-03-06 | |||
| JP2012043886A | 2012-03-01 | |||
| JP2012160618A | 2012-08-23 | |||
| JP2003332796A | 2003-11-21 | |||
| JP2004103895A | 2004-04-02 | |||
| JPH09205296A | 1997-08-05 | |||
| JP2006135023A | 2006-05-25 |
Attorney, Agent or Firm:
Hiroaki Sakai