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Title:
ELECTRONIC COMPONENT PAINTING METHOD
Document Type and Number:
Japanese Patent JPH06314642
Kind Code:
A
Abstract:

PURPOSE: To suppress generation of a hole of a painted part of conductive paste and to improve productivity by preventing the generation of the hole due to air engulfing in the paste coating an end of a chiplike electronic component in a short time.

CONSTITUTION: In order to coat an end of a chiplike electronic component 8 with conductive paste 13, the component 8 is dipped in the paste 13 in a helium chamber 14 partitioned from an exterior to be a helium gas atmosphere. Then, the component 8 is removed from the chamber 14 at each jig 1, an end of the component 8 of a side coated with the paste 13 is directed toward an upside, and helium engulfed in the coated paste 13 is externally discharged.


Inventors:
URANO TETSUYA
UEHARA TAKAYUKI
Application Number:
JP12791793A
Publication Date:
November 08, 1994
Filing Date:
April 30, 1993
Export Citation:
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Assignee:
TAIYO YUDEN KK
International Classes:
B05D1/18; B05D3/00; B05D3/04; B05D7/00; H01C17/00; H01G13/00; (IPC1-7): H01G13/00; B05D1/18; B05D3/00; B05D3/04; B05D7/00; H01C17/00
Attorney, Agent or Firm:
Kazuyoshi Hojo



 
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