To provide an electronic component capable of extensively miniaturizing and easily manufacturing and a sensor equipped with the electronic component.

By the structure of the substrates 21 and 22 which are mutually piled while holding the conductive patterns 221-223 in between, the holes on the substrates 21 and 22 can be eliminated because the substrate piled body 20 makes a continuity through the conductive patterns 221-223. Therefore, the dead space necessary for providing the holes can be eliminated. Consequently the extensive miniaturization can be attained, and the conductive patterns 221-223 and the substrates 21, 22 are only connected while dispensing with boring, and the easy and low cost manufacturing can be allowed. Therefore, both end faces 23, 24 of the substrate piled body 20 can be brought in continuity and at the same time communication of the air is allowable i.e. field through structure can be realized, and the ultra small pressure sensor 1 can be manufactured.