To solve the following problem: when sucking an electronic component with a suction nozzle, suction mistakes frequently occurs because the electronic component adheres to a wall or the like of a housing part of a carrier tape by static.
An electronic component is supplied using this electronic component supply device including: a reel holding means to rotatably support a reel with electronic component transport bodies closing through-holes wound by storing electronic components in through-holes of a carrier tape and sticking a top cover tape and a bottom cover tape to the front and back surfaces of the carrier tape, respectively; a peeling means to peel the top cover tape of the electronic component transport bodies extracted from the reel; a transport means to sequentially transport the electronic component transport bodies with the top cover tape peeled therefrom; and a blowing means to blow air containing ions to the front surfaces and/or the back surfaces of the electronic component transport bodies after being extracted from the reel and before the top cover tape is peeled therefrom.
KASHIWAGI KOTARO
IKETANI SUMIO
KOA CORP
YAMAHA MOTOR CO LTD
| JP2009111413A | 2009-05-21 | |||
| JP2004022865A | 2004-01-22 | |||
| JPH0557900U | 1993-07-30 | |||
| JPH04345093A | 1992-12-01 | |||
| JP2000332491A | 2000-11-30 | |||
| JP2003225625A | 2003-08-12 | |||
| JP5402958B2 | 2014-01-29 |
Next Patent: METHOD OF PROCESSING WAFER, AND WAFER PROCESSED BY THE SAME