Title:
電子部品ユニット、その製造方法、および電子部品ユニットを備えた電子機器の製造方法
Document Type and Number:
Japanese Patent JP7388099
Kind Code:
B2
Abstract:
To suppress a force applied to an electronic component or a holder when packaging an electronic component unit on a substrate.SOLUTION: An electronic component unit (2) includes a holder (6) and a packaging member (8). The holder is used to fix an electronic component (4). A packaging member includes a fixing pin (42) for fixing on the holder and a receiving part (44) arranged on the top of the fixing pin and receiving a pressure applied when packaging an electronic component.SELECTED DRAWING: Figure 1
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Inventors:
Mitsuru Kurosu
Osamu Ichikura
Osamu Ichikura
Application Number:
JP2019177870A
Publication Date:
November 29, 2023
Filing Date:
September 27, 2019
Export Citation:
Assignee:
Nippon Chemi-Con Corporation
International Classes:
H01G2/02; H01G2/06; H01G9/00; H01G9/048; H01G9/10; H05K7/12
Domestic Patent References:
| JP2017208409A | ||||
| JP2008124244A | ||||
| JP2006100658A |
Foreign References:
| WO2018020993A1 |
Attorney, Agent or Firm:
Masakazu Unemoto
Tsugitate Uemoto
Takuya Uemoto
Masaki Okita
Tsugitate Uemoto
Takuya Uemoto
Masaki Okita