Title:
ELECTRONIC COMPONENT WITH INTERPOSER
Document Type and Number:
Japanese Patent JP2019161137
Kind Code:
A
Abstract:
To provide an electronic component with an interposer, capable of preventing a characteristic deterioration or failure or the like in accordance with a temperature rising from generating by performing a heat transfer from a component main body of an electronic component to the interposer without inclination.SOLUTION: An electronic component with an interposer CWI, comprises: an electronic component 10; and an interposer 20. An adhesive part 40 is provided between an opposite space OS of a component main body 11 of the electronic component 10 and a substrate 21 of the interposer 20. The adhesive part 40 is structured by a plurality of unit adhesive parts 41 which is not contacted each other. In the plurality of unit adhesive parts 41, the arrangement number along a second direction d2 is arranged in a two-dimensional direction d2 of which both sides are less than a middle of a first direction d1.SELECTED DRAWING: Figure 6
Inventors:
SHIMURA TETSUO
NAKATA YOSUKE
INOMATA YASUYUKI
NAKATA YOSUKE
INOMATA YASUYUKI
Application Number:
JP2018048836A
Publication Date:
September 19, 2019
Filing Date:
March 16, 2018
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G2/08; H01G2/06; H05K7/20
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| JP2017188545A | 2017-10-12 | |||
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Attorney, Agent or Firm:
Takahiro Miyahara