Title:
ELECTRONIC COMPONENT WITH METAL TERMINAL AND ELECTRONIC COMPONENT MOUNTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2019062042
Kind Code:
A
Abstract:
To provide an electronic component with metal terminals that can prevent as much as possible a phenomenon that excess molten solder gets wet on a surface on an electronic component side of a unit to be connected of each of the metal terminals and a surface on an electronic component side of a support unit and a surface on the opposite side when connecting the unit to be connected of each of the metal terminals to each of conductor pads of a circuit board using solder.SOLUTION: An electronic component with a metal terminal includes: a multilayer ceramic capacitor 10 having a pair of external electrodes 12; and a pair of metal terminals 20 each integrally having a plate-like support unit 21 and a plate-like unit 22 to be connected. The support units 21 of the metal terminals 20 are joined to the external electrodes 12 so that the units 22 to be connected face each other. Two convex portions 23 are provided on a surface to be connected of the unit 22 to be connected of each of the metal terminals 20.SELECTED DRAWING: Figure 1
Inventors:
SAITO NAOKI
Application Number:
JP2017184612A
Publication Date:
April 18, 2019
Filing Date:
September 26, 2017
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/228; H01G2/06; H01G4/232; H01G4/30
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Foreign References:
| US4320281A | 1982-03-16 | |||
| WO2018194153A1 | 2018-10-25 |
Attorney, Agent or Firm:
Takahiro Miyahara