To provide an electronic component, where at surface-mounting on a fitting substrate, the stability in mounting is very superior, while facilitating reflow-soldering.

One electrode surface of a component element 52 is housed in a bottomed cylinder metal case 11 so as to contact the inner bottom part, and its opening part is sealed with a bottomed cylinder insulating case 14, which prevents contact and short between the side surface of the bottomed cylinder metal case 11 and the side surface of component element. A plate-like lead terminal 13 is led out of the electrode surface of the component element 52 penetrating through the insulating case 14, a plate-like lead terminal 12 provided on the outside surface of the insulating case, at the opening part of the cylinder metal case, is led out to the same end part as the end part, forming an electronic component main body. An insulating plate 17 is provided so as to contact the end surface, where a pair of plate-like lead terminals 12 and 13 of the electronic part main body are led out. The insulating plate 17 comprises an electrically insulating material having heat resistance, and through- holes 4 and 4 which penetrate the pair of plate-like lead terminals 12 and 13.