Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2003179085
Kind Code:
A
Abstract:

To provide an electronic component in which malfunction due to heat or the change of the operation can be prevented and which has high productivity and reliability.

The electronic component comprises a cover 220 made of a glass and integrally connected to a base 211 made of a silicon material, a micro- relay chip 210 assembling a movable piece 213 and coating with the cover 220, and a base 230 resin-molded so as to expose the bottom of the base 211.


Inventors:
Sakata, Minoru
Nakajima, Takuya
Seki, Tomonori
Fujiwara, Teruhiko
Takeuchi, Tsukasa
Application Number:
JP2002000238565
Publication Date:
June 27, 2003
Filing Date:
August 26, 1997
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OMRON CORP
International Classes:
H01L41/08; H01H11/00; H01H37/14; H01H37/52; H01H57/00; H01L21/56; H01L23/02; H01L41/09; H01L41/18; (IPC1-7): H01L21/56; H01L41/08; H01L41/09; H01L41/18
Attorney, Agent or Firm:
青山 葆 (外4名)