To provide a surface-mounted electronic component having a mount surface to be mounted on a printed circuit board, the electronic component being characterized in that sufficient insulation can be secured between external electrodes and high mounting strength is obtained even when the chip size is made small.
For example, the external electrode 13 of a common-mode choke coil array 1 comprises electrode pads 13c and 13b formed on mount surfaces of insulating substrates 3 and 5 mounted on a PCB 121, and a connection electrode 13a which electrically connects an internal electrode terminal 31 exposed on an external surface different from the mount surfaces to the electrode pads 13b and 13c. Electrode widths c' of connection electrodes 13a, 15a, 21a, and 23a nearby internal electrode terminals 31, 33, 39, and 41 are made shorter than pad widths (b) of the electrode pads 13b, 15b, 21b, and 23b which are measured in the same direction.
KUDO TAKAKIYO
OTOMO MAKOTO
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