To improve the reliability of an electronic component 1 for electric characteristics.

The electronic component 1 is provided with a laminated section 5 formed by laminating a plurality of forming layers of conductive patterns 4 upon another through insulating layers 3 and pressurizing the laminate. In the component 1, a plurality of conductive patterns 4A and 4B having different potentials are arranged through an insulating clearance on the surface of at least one conductive pattern forming layer and, at the same time, a floating dummy pattern 10 is provided which is not connected electrically to the conductive patterns 4A and 4B. The floating dummy pattern 10 is positioned between the conductive patterns 4A and 4B formed on the surface of one conductive pattern forming layer and having different potentials and, in addition, so that the pattern 10 may overlap a floating dummy pattern 10 or conductive pattern formed on another conductive pattern forming layer.