Title:
ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2019114669
Kind Code:
A
Abstract:
To provide an electronic component capable of suppressing infiltration of a plating solution into an inside of an element body.SOLUTION: An electronic component 1 includes: an element body 2; a terminal electrode provided on a main surface of the element body 2; a connection conductor 4 having a metal shield film 3 provided on a side surface 2e of the element body away from the terminal electrode, an end face disposed inside the element body 2 and connected to the terminal electrode, and a second end face 4b connected to the metal shield film 3; and a plating film 12 provided on the second end face 4b and connecting the second end face 4b and the metal shield film 3. The element body 2 has a covering portion 2m that covers an edge 4c of the second end face 4b.SELECTED DRAWING: Figure 3
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Inventors:
SATO YOSHINORI
DOI SHIGEYUKI
OGIMOTO TATSUO
DOI SHIGEYUKI
OGIMOTO TATSUO
Application Number:
JP2017247337A
Publication Date:
July 11, 2019
Filing Date:
December 25, 2017
Export Citation:
Assignee:
TDK CORP
International Classes:
H01G2/22; H01F27/00; H01F27/23; H01F27/29; H01F27/36; H01G4/252
Domestic Patent References:
| JP2017076796A | 2017-04-20 | |||
| JP2012114172A | 2012-06-14 | |||
| JP2013004980A | 2013-01-07 | |||
| JP2005175165A | 2005-06-30 |
Foreign References:
| KR20050082225A | 2005-08-23 | |||
| US20150364255A1 | 2015-12-17 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami
Yoshiki Kuroki
Takashi Mikami