Title:
ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2023123180
Kind Code:
A
Abstract:
To provide an electronic component capable of preventing unexpected adhesion of a mold resin to an outer surface of the product.SOLUTION: An electronic component includes: a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal having an electrode connecting part connecting to the ceramic element, a mounting part exposed from the accommodation part, and a terminal arm part connecting the electrode connecting part with the mounting part; a case cover having a closing plate part for closing the opening, and a cover edge part protruding in a depth direction of the accommodation part from a peripheral edge of the closing plate part and at least partially facing an accommodation part side wall which is a side wall of the accommodation part; and a mold resin filling the accommodation part.SELECTED DRAWING: Figure 1
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Inventors:
SATO TAKAAKI
MASUDA YOSHITAKE
ITO SHINYA
ANDO NORIHISA
KANEKO HIDEKI
YUKAWA KEN
TAMAKI KENYA
YOSHII AKITOSHI
MASUDA YOSHITAKE
ITO SHINYA
ANDO NORIHISA
KANEKO HIDEKI
YUKAWA KEN
TAMAKI KENYA
YOSHII AKITOSHI
Application Number:
JP2022027092A
Publication Date:
September 05, 2023
Filing Date:
February 24, 2022
Export Citation:
Assignee:
TDK CORP
International Classes:
H01G2/10; H01G4/224; H01G4/228
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation