Title:
ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3277308
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To decrease disconnection failour of a lead terminal by a positioning mark required for positioning of the lead terminal by a method wherein a bonding positioning mark is provided at a terminal tip part located outside in a direction of extending the lead terminal near an external connection part provided on the extending tip side of the lead terminal.
SOLUTION: A TCB (Tape Carrier Package) device 200 is provided with a bonding positioning mark 21f. The positioning mark 21f is provided in an external connection part 21e. That is, the positioning mark 21f is structured so as to form widely a part of the external connection part 21e, and is not connected to a support ring 13. Since a shape is the same, an outer lead part 21b is told clearly from an outer lead part 21b having the positioning mark 21f. Therefore, it is possible to adjust position with high precision by correctly answering the outer lead part 21b to electrode groups on a circuit board.
Inventors:
Yasuhiro Sakamoto
Application Number:
JP22162595A
Publication Date:
April 22, 2002
Filing Date:
August 30, 1995
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/60; H05K1/02; H05K3/34; (IPC1-7): H01L21/60
Domestic Patent References:
JP574851A | ||||
JP1287937A | ||||
JP5343469A | ||||
JP5237768A | ||||
JP5834952A | ||||
JP2134839A | ||||
JP4234141A | ||||
JP5073382U |
Attorney, Agent or Firm:
Kazuhide Okada
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