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Title:
電子部品及びその製造方法
Document Type and Number:
Japanese Patent JP4929483
Kind Code:
B2
Abstract:
An electronic component includes a multilayer composite including first insulating layers, second insulating layers, and a helical coil. The helical coil is disposed within the multilayer composite and includes a plurality of coil conductors connected to each other with a plurality of via hole conductors. The coil is located corresponding to the region defined by the second insulating layers when viewed in a stacking direction of the first and second insulating layers. The second insulating layers are located in the region coinciding with the locus of the coil without covering the via hole conductors when viewed in the stacking direction.

Inventors:
Yoshiko Sakano
Youichi Nakatsuji
Application Number:
JP2009161934A
Publication Date:
May 09, 2012
Filing Date:
July 08, 2009
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01F17/00; H01F41/04
Domestic Patent References:
JP2007324554A
JP2007324555A
JP59032115A
JP2005223261A
Foreign References:
WO2008004633A1
Attorney, Agent or Firm:
Takeichi Morishita
Tani Kazuhiro



 
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