電子部品及びその製造方法 - MURATA MANUFACTURING CO.,LTD.

Title:

電子部品及びその製造方法

Document Type and Number:

Japanese Patent JP5212309

Kind Code:

B2

Abstract:

To provide an electronic component that can prevent a laminate from cracking and also suppress a defect in connection with a substrate, and to provide a method of manufacturing the same.

Connection conductor layers 20a, 20b are provided on a reverse surface S1 while forming a gap G. An insulator layer 22 covers outer edges e1, e2, forming the gap G, of the connection conductor layers 20a, 20b. The connection conductor layer 24a is provided over the connection conductor layer 20a. The connection conductor layer 24b is provided over the connection conductor layer 20b. Principal surfaces of the connection conductor layers 24a, 24b are more apart from the reverse surface S1 than from a principal surface of the insulator layer 22.

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Inventors:

Kaori Takezawa
Hiromi Miyoshi
Three saki Katsuhiro

Application Number:

JP2009187346A

Publication Date:

June 19, 2013

Filing Date:

August 12, 2009

Export Citation:

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