Title:
電子部品
Document Type and Number:
Japanese Patent JP6934322
Kind Code:
B2
Abstract:
To improve heat dissipation from a function element.SOLUTION: An electronic component comprises: a first substrate 10 having a first surface; a second substrate 20, having a second surface provided with one or more function elements, which is mounted on the first substrate such that the one or more function elements face the first surface across a gap; a connection terminal which is arranged between the first surface and the second surface so as to connect the first substrate to the second substrate; and an insulator film, arranged on either one of the first surface or the second surface, which surrounds at least one of the one or more function elements in plan view. The distance between the insulator film and at least one of the function elements is shorter than that between the connection terminal and at least one of the function elements. The insulator film has a third surface at least part of which faces the other one of the first surface and the second surface across the gap.SELECTED DRAWING: Figure 1
Inventors:
Shutaro Nakazawa
Takashi Matsuda
Takashi Matsuda
Application Number:
JP2017104118A
Publication Date:
September 15, 2021
Filing Date:
May 26, 2017
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H03H9/25; H01L23/36; H03H9/02; H03H9/145; H03H9/17; H03H9/64; H03H9/72
Domestic Patent References:
| JP2002510929A | ||||
| JP5055303A |
Attorney, Agent or Firm:
Shuhei Katayama