To solve such a problem that the heat from a heating part may possibly affect a low heat resistance component, when a heat-generating component and a low heat resistance component are mounted while being spaced apart simply from each other.
In the inner space of a housing formed by bonding a housing case 12, a housing cover 13, and the like, a circuit board mounting a heat-generating component 14a generating heat according to operation, and a low heat resistance component 14b having heat resistance lower than that of the heat-generating component 14a is housed. The electronic controller includes a cover 40 for heat-generating part consisting of a barrier 40a surrounding the heat-generating part of a circuit board 11 by the heat-generating component 14a, and a cover 41 for a low heat resistance component consisting of a barrier 41a surrounding the low heat resistance component 14b mounted on the circuit board 11.
| JP5681967 | Electronics |
| JP2001274577 | FITTING STRUCTURE OF HEATING ELEMENT |
ICHIKAWA EIJI
| JPH07235792A | 1995-09-05 | |||
| JPH06507049A | 1994-08-04 | |||
| JP2002330523A | 2002-11-15 | |||
| JPH09129451A | 1997-05-16 |
Tomioka Kiyoshi
Tsuyoshi Hashimoto
Next Patent: ELECTRONIC CONTROL DEVICE