Title:
電子機器収容装置および電子機器冷却システム
Document Type and Number:
Japanese Patent JP6536406
Kind Code:
B2
Abstract:
A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.
Inventors:
Minoru Yoshikawa
Kenichi Inaba
Masanori Sato
Alley Akatsuki
Matsunaga Yuji
Masaki Chiba
Kenichi Inaba
Masanori Sato
Alley Akatsuki
Matsunaga Yuji
Masaki Chiba
Application Number:
JP2015548984A
Publication Date:
July 03, 2019
Filing Date:
November 14, 2014
Export Citation:
Assignee:
NEC
International Classes:
H05K7/20; F25D9/00; F28D15/02; G06F1/20
Domestic Patent References:
| JP2011171499A | ||||
| JP2012146331A |
Foreign References:
| US7315448 | ||||
| WO2011122207A1 | ||||
| WO2012144123A1 |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka