To provide means for securing conductivity between an electronic component and an external electrode in an electronic device provided with the electronic component mounted on a base and a through electrode where the base and the external electrode provided on the side opposite to the side on which the electronic component of the base is mounted are welded to each other.

The electronic device comprises: a base 10; a through electrode 21 passing through the base 10 which an insulating substance on the end face is removed by polishing; an electronic component 40 which forms a circuit pattern 30 on one end face of the through electrode 21 and is provided through an internal wiring 31 formed on the circuit pattern 30; an external electrode 61 which is provided on the side opposite to the side provided with the electronic component 40 of the base 10, forms an electrode pattern 60 connecting to the other end face of the through electrode 21, and is formed on the electrode pattern 60; and a cap 50 which connects to the base and protects the electronic component 40 on the base 10.