Title:
電子機器筐体、その製造方法および金属樹脂複合体
Document Type and Number:
Japanese Patent JP7299974
Kind Code:
B2
Abstract:
Provided is an electronic device housing including a metal member and a plastic antenna cover that are joined and integrated by insert molding. In this electronic device housing, the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250°C.
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Inventors:
Takahiro Tominaga
Umi Morimoto
Kazuki Kimura
Wataru Makiguchi
Kosuke Ueda
Umi Morimoto
Kazuki Kimura
Wataru Makiguchi
Kosuke Ueda
Application Number:
JP2021516123A
Publication Date:
June 28, 2023
Filing Date:
April 21, 2020
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
H05K5/02; B21D47/04; B21D53/00; B29C45/14; H05K5/00; H05K5/03
Domestic Patent References:
| JP2017199803A | ||||
| JP2007238684A | ||||
| JP2009262530A | ||||
| JP200858669A |
Attorney, Agent or Firm:
Shinji Hayami
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