Title:
ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2004028812
Kind Code:
A
Abstract:
To enable appropriate wire bonding while mounting a sensor chip to a case without using any bonding agents in a pressure sensor where the sensor chip is mounted onto the case having a lead frame and is connected to the lead frame by a bonding wire.
A hole 12 passing through the case 10 is provided on a chip mounting surface 11 in the case 10, the sensor chip 30 is mounted so that the hole 12 is covered, and wire bonding is made to the sensor chip 30 and the lead frame 20 while the sensor chip 30 is fixed to the case 10 by sucking the sensor chip 30 from the hole 12 by a suction pump 100, thus fixing the sensor chip 30 to the case 10 by the sucking force from the hole 12, and hence preventing the sensor chip 30 from moving in wire bonding.
Inventors:
ARAYA YOSHIHIRO
Application Number:
JP2002186032A
Publication Date:
January 29, 2004
Filing Date:
June 26, 2002
Export Citation:
Assignee:
DENSO CORP
International Classes:
G01L9/00; H01L21/52; H01L21/60; H01L23/02; H01L29/84; (IPC1-7): G01L9/00; H01L21/52; H01L21/60; H01L23/02; H01L29/84
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno
Takahiro Miura
Fumihiro Mizuno
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