Title:
ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2012125894
Kind Code:
A
Abstract:
To reduce an amount of outgassing remaining in an electronic device after sealing, in the electronic device, and to provide its manufacturing method.
The method for manufacturing the electronic device has the steps of: forming an underlying film 21 on a substrate 20; forming a seal 25b made by exposure and development of photosensitive resin on the underlying film 21; curing the seal 25b by heating the seal 25b; sealing a switching element 19 with the seal 25b by attaching the seal 25b to the switching element 19 formed on the substrate 1; and peeling off the substrate 1 from the seal 25b with the underlying film 21 as a border after sealing.
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Inventors:
INOUE HIROAKI
NAKATANI TADASHI
KATSUKI TAKASHI
UEDA TOMOSHI
NAKATANI TADASHI
KATSUKI TAKASHI
UEDA TOMOSHI
Application Number:
JP2010280534A
Publication Date:
July 05, 2012
Filing Date:
December 16, 2010
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B81C3/00; B81B3/00; H01G4/33; H01G7/00; H01L23/02; H01L23/10
Domestic Patent References:
| JP2004255487A | 2004-09-16 | |||
| JP2009530823A | 2009-08-27 | |||
| JP2004255487A | 2004-09-16 |
Foreign References:
| US0007023A | 1850-01-15 |
Attorney, Agent or Firm:
Keizo Okamoto