Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021197358
Kind Code:
A
Abstract:
To provide an electronic device and a manufacturing method thereof capable of reducing the number of components and electrically joining external connection terminals on a metal wiring pattern formed on a thermoformed base material with high position accuracy.SOLUTION: An electric device includes: a base material that is made of a synthetic resin material and can be transformed from a substantially flat two-dimensional shape to a substantially three-dimensional shape; an external connection terminal that electrically connects a metal wiring pattern placed on the base material, and an external element that comes into contact with the metal wiring pattern at a recess shaped into a three-dimensional shape in the thickness direction of the base material by thermoforming the base material and is provided outside the base material; a resin layer that forms a housing that surrounds the external connection terminal such that the terminal surface which is the surface of the external connection terminal is exposed, and covers at least one surface of the base material; joining means that electrically joins the metal wiring pattern and the external connection terminal in the recess; and a coating layer that is filled in the recess and covers the joining means.SELECTED DRAWING: Figure 3
Inventors:
SUGIMOTO MASAAKI
YOKOYAMA HIDEAKI
OIDA YUICHI
FUJIMAKI KIYOSHI
YOKOYAMA HIDEAKI
OIDA YUICHI
FUJIMAKI KIYOSHI
Application Number:
JP2021039813A
Publication Date:
December 27, 2021
Filing Date:
March 12, 2021
Export Citation:
Assignee:
ELEPHANTECH INC
TAKAHATA PREC CO LTD
TAKAHATA PREC CO LTD
International Classes:
H01R12/71; H01L23/12; H01L23/14; H01L33/54; H01L33/62; H01R43/24
Attorney, Agent or Firm:
Yukinori Sezaki