Title:
ELECTRONIC DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH06302792
Kind Code:
A
Abstract:
PURPOSE: To realize structure, in which sections among chips are connected electrically and mechanically at the same time, in a multiple chip mounting type semiconductor device.
CONSTITUTION: Connecting chips 4 having wirings and electrodes on the surfaces of silicon or glass are mounted in a face down manner in mutual driving substrate 3, on which a plurality of semiconductor image sensor chips 1 and semiconductor driving chips 2 are mounted, and semiconductor image sensor chips 1 and the semiconductor image sensor chips 1 and the driving substrate 3.
Inventors:
BANDAI MASAAKI
TAKEUCHI HITOSHI
YOSHINO TOMOYUKI
SAITO YUTAKA
TAKEUCHI HITOSHI
YOSHINO TOMOYUKI
SAITO YUTAKA
Application Number:
JP10158893A
Publication Date:
October 28, 1994
Filing Date:
April 27, 1993
Export Citation:
Assignee:
SEIKO INSTR INC
International Classes:
H01L23/538; H01L27/14; (IPC1-7): H01L27/14; H01L23/538
Attorney, Agent or Firm:
Keinosuke Hayashi